Hardware Design Engineer (PCB Layout)

About the role

VERSOM, a joint venture between DEICO and EMPA Electronics, develops high-performance System-on-Module (SoM) platforms, carrier boards and embedded computing solutions for defense, aerospace and industrial applications. It is looking for a Hardware Design Engineer focused on PCB layout to join its engineering team in Ankara. The engineer turns schematics for SoM and carrier board designs into high-density, high-speed and manufacturable PCBs.

Key responsibilities

• Place components and route PCBs for AMD SoC-based (Versal, MPSoC, Zynq) SoM and carrier boards, from schematic handoff to manufacturing release.
• Define PCB stackups and controlled-impedance structures with the hardware team and PCB manufacturers.
• Route high-speed interfaces (DDR4, LPDDR4/LPDDR5, PCIe, GTY/GTYP transceivers, Ethernet, USB) with length and phase matching, differential pair constraints and reference planes.
• Implement fine-pitch BGA fan-out and HDI structures, including microvias, blind and buried vias and via-in-pad.
• Design PDNs, plane structures and decoupling capacitor placement according to power integrity requirements.
• Support signal integrity and power integrity analysis, design iterations and optimization.
• Create schematic symbols, PCB footprints and 3D component models; coordinate with mechanical engineers on board outlines and connectors.
• Run DRC and DFM/DFA reviews, prepare manufacturing documentation (Gerber/ODB++, drill files, assembly drawings, pick-and-place files) and work with fabrication and assembly suppliers.
• Support prototype bring-up and rework activities.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering, Electronics and Communication Engineering or a related field.
• At least 5 years of hands-on PCB layout experience on complex multilayer digital boards.
• Experience with DDR memory interfaces and high-speed serial interfaces (PCIe, multi-gigabit transceivers, Ethernet).
• Experience with 10+ layer boards, fine-pitch BGA fan-out and HDI.
• Knowledge of IPC standards, DFM/DFA and controlled impedance, stackup, return paths, crosstalk and EMI/EMC practices.
• Ability to read schematics and datasheets, good technical English.

Required skills

• Altium Designer, Cadence Allegro or Siemens Xpedition/PADS
• High-speed PCB design and manufacturing documentation

What we offer

• Advanced engineering challenges on high-performance embedded computing platforms.
• DEICO's hardware engineering, PCB development and manufacturing expertise.
• EMPA's component sourcing, supply chain and product lifecycle expertise.
• Opportunity to grow with a new venture.